Track 1
08:30Registration
10:00Welcome Notes
- Fachverband Elektronikdesign und -fertigung e. V. (FED)
- Global Electronics Association
10:30Special Session: AI in Product Development
AI in Electronics Product Development: Separating Hype from Reality
- Tomide Adesanmi (Circuit Mind)
Rethinking Energy: Passive Components Unlock Sustainable AI
- Alexander Gerfer (Würth Elektronik eiSos, Germany)
12:00Lunch
13:30Special Session: t.b.d.
t.b.d.
- t.b.d.
t.b.d.
- t.b.d.
15:00Coffee Break
15:30Special Session: Single Pair Ethernet
Why Single Pair Ethernet is Ushering in a New Era
- Simon Seereiner (Weidmüller Interface GmbH & Co. KG)
- Thomas Keller (Rosenberger Hochfrequenztechnik GmbH & Co. KG)
Design Requirements for Single Pair Ethernet
Panel with
- Simon Seereiner (Weidmüller Interface GmbH & Co. KG)
- Thomas Keller, (Rosenberger Hochfrequenztechnik GmbH & Co. KG)
- Steffen Graf (Texas Instruments, Inc.)
- Matthias Karcher (Microchip Technology, Inc.)
17:00Wrap-up Day 1
17:30Reception
Food and drinks
Track 1
Silicon-to-Systems
08:30Package–PCB–Co-Design
Advanced.hdi – Bridging the Gap Between Chip and PCB – “Silicon to systems” – to enable Stack-Ups forHigh-Speed, High-Density Designs
- Michael Kress
UHDI PCBs vs. IC Substrates: Navigating the Overlap in Advanced Packaging
- Jan Pedersen
Additive Manufacturing for Advanced Microelectronic Packaging: Integration of Silicon Bare Dies viaInkjet Printing and NIL
- Pavel Kulha
10:00Coffee Break
Coffee Break
10:30Power Electronics
Enhancing Power Electronic Design Efficiency through Real-Time Thermal Feedback
- Wilfried Wessel
Approach for Coupled Simulations of Magnetic Power Loss and Temperature Distribution of a DC/DCConverter Used for Electric Vehicles
- Nicolae Badulescu
Hands-On Challenges and Solutions in Bidirectional GaN Switch Design
- Milan Marjanovic
12:00Lunch break
Lunch break
13:30Multi-Physics Simulation
Digital Twins for Efficient Power Circuit Design
- Dr. Mohammed Ali Khan
From Discrete to Integrated: Pitfalls and Best Practices in 3D FEM Modeling of Magnetic Components
- Juris Vencels
Finite element modelling and analysis of through-hole-technology assemblies for space applications
- Dr. Harald Ziegelwanger
15:00Coffee Break
Coffee Break
15:30Simulation Driven Design
PCB Embedding Technology: A pathway to enhanced product integration
- Janagan Papperi
- Devarajulu Deenadayalan
Simulation-Driven Insights into Copper Plating and Via Filling
- Robrecht Belis
Universal Simulation Environment for Comprehensive Electronic System Resilience
- Tomáš Kašpar
Track 2
AI, Software & Tools
08:30AI for Product Development
FPGA-Driven AI for Real-Time Fault Detection and HIL Validation
- Cristina Villegas Soriano
Deep Learning for Automated Netlist Generation from Impedance Spectra
- Richard Blakey
Demystifying the use of AI, ML and LLMs for High-Speed PCB-Design and Signal-/Power-Integrity Issues
- Ralf Bruening
10:00Coffee Break
Coffee Break
10:30DFX
How the new challenges of electronics will impact DfM?
- Nicolas Feyfant
Design for Expected Costs – Continuous Cost-Assessment for Better Products
- Sebastian Schaal
Cost-Effective Design: Reducing Manufacturing Expenses Before Production Begins
- Paul Carpine
12:00Lunch Break
Lunch Break
13:30DFM
3D Soldermask: New Features & Capabilities to improve PCB Quality by Additive Design
- Celia Wenzler
Design for Manufacturing – in Selective Reflow Processes (Rework)
- Joerg Nolte
Forgotten, misjudged, indispensable? Backdrilling in a high-speed check!
- Radek Reichel
15:00Coffee Break
Coffee Break
15:30Design Rules and Design Validation
Automated 3D Analysis of Clearance and Creepage Paths in PCB Design
- Dr. Michael Martinek
Design Rules for Depaneling and the matching Workpiece Carriers
- Patrick Stockbrügger
t.b.d
- t.b.d
17:00Closing Ceremony PEDC 2026
Closing Ceremony PEDC 2026
Track 3
Sustainable Design, PLC & AI
08:30Sustainable Design and PLC
From Principles to Practice: Cisco’s Journey to Embed Circularity into Product Design
- Mrs. Wendy Ng
DPP4E: Increasing Circularity and Transparency in the Electronics Product Life Cycle through DigitalProduct Passports
- Wilfried Lepuschitz
SustainaCircuits – etching free inkjet based printed circuit board
- Keisuke Ito
10:00Coffee Break
Coffee Break
10:30Sustainable Design, Materials & Processes
Towards Sustainable PCB Design: Process Efficiency and Material Innovation for a Greener Lifecycle
- Jürgen Wolf
SMT, COB, FC and PE in combination and requirementsfor the application of solder paste for the different technologies
- Jörg Trodler
SustainaCircuits – etching free inkjet based printed circuit board
- Keisuke Ito
12:00Lunch Break
Lunch Break
13:30AI and a Sustainable Development Process I
Using Agentic AI to drive down EMS and OEM compliance and design costs
- Francis D’Souza
- Dhanish M S
- tbd
15:00Coffee Break
Coffee Break
15:30AI and a Sustainable Development Process II
Enhancing Simulative Product Development with Machine Learning (ML) and Artificial Intelligence (AI)
- Rene Fuger
- Carsten Kindler
