21-22

January 2026

Prague –

Czech Republic

2nd Pan-European
Electronics Design
Conference

Two days of peer reviewed presentations and expert panels delivering immediate, actionable techniques for electronics design, verification and production.

Secure Your Spot at the 2nd PEDC!

Register Now

Joining forces

The Pan-European Electronics Design Conference is jointly hosted and organized by the Electronics Design and Manufacturing Association (FED) and the Global Electronics Association – two associations representing more than 3,700 companies from the electronics industry.

PEDC in a nutshell

The 2nd Pan-European Electronics Design Conference (PEDC) is a one of a kind Pan-European conference with technical and scientific peer-reviewed presentations. It will take place on January 21-22 in Prague. The conference focuses on connecting the European EE Industry and Scientific Community and highlights the latest developments in electronics design from “Silicon to Systems”. Topics will include Development, Design for Excellence, Software and Tools, and the Design Process of electronic systems.

What you will be taking away

How to shorten design cycles without sacrificing reliability
Best practices for design for excellence in production
Tools & workflows to bridge software and hardware design
All technologies and processes for the development and production of electronic assemblies and systems
Unique exchange of experience with experts from industry and research

Speaker Testimonials

PEDC 2025

Francis D’Souza
Banyan.eco, France
Susan Kayesar
Siemens AG, Germany
Octavian Luca
Schaeffler AG, Romania
“Following the highly successful inaugural Pan-European Design Conference, join us for the second PEDC to connect with European electronics designers and experts, exchange insights and help shape the future of European electronics. 
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Dieter Müller
Chairman of the FED Board, Owner BMK Group
“With the 2nd PEDC, we are continuing the success story of the new format of Pan-European Electronic Design Conference. As in the first edition, a Europe-wide panel of experts will compile the technical programme according to high quality standards and free from commercialisation. 
Tranitz web
Dr. Peter Tranitz
Global Electronics Association
“With AI today, if you’ve got to generate product carbon footprint for your electronic devices, for your sub-assemblies, from your cradle to gate or cradle to grave, instead of taking weeks, you can now take two minutes.”
PEDC Francis De Sousa
Francis D’Souza
Banyan.eco
“Having a protection in the supply chain is very crucial to be sure that you know your supply chain and that you know who’s part of your supply chain.” 
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Guro Krosson
Confidee
“Transparency and collaboration are really going to be the key going forward in this industry to make it successful.” 
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Susan Kayesar
Siemens
“Automotive high-voltage design without simulation with component-level support is a wrong choice. Only by using accurate models you can assure your safety and precision in the early development phase of your product.”
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Octavian Luca
Schaeffler AG Group

Sponsors

Exhibitors

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