Joining forces
The Pan-European Electronics Design Conference is jointly hosted and organized by FED and IPC – two associations representing more than 3,700 companies from the electronics industry.
PEDC in a nutshell
The 1st Pan-European Electronics Design Conference (PEDC) is a one of a kind Pan-European conference with technical and scientific peer-reviewed presentations. It will take place on 29-30 January in Vienna. The conference focuses on connecting the European EE Industry and Scientific Community and highlights the latest developments in electronics design from “silicon-to-systems”. Topics will include Development, Design for Excellence, Software and Tools, and the Design Process of electronic systems.
“The PEDC is a new industry platform that offers companies beyond the borders of the D-A-CH region the opportunity to find out about current trends in the European electronics industry and to make new contacts in industry and science.”
Dieter Müller, Chairman of the FED Board, Owner BMK Group
“In the European conference landscape, PEDC is a new format with presentations that have been selected by a Europe-wide panel of experts according to high quality standards and are free from commercialisation.”
Dr. Peter Tranitz, Senior Director Technology Solutions, IPC
Abstract Submission
PEDC organization team invites engineers, researchers, academics, students, technical experts, and industry leaders to submit abstracts for the Pan-European Electronics Design Conference.
We welcome abstracts summarizing original and previously unpublished work covering case histories, research, and discoveries.
Conference Topics
Silicon-to-Systems
- Advanced Packaging
- PCB/PCBA
- Sub-system assembly
- Final system assembly
- Electro-mechanical co-design
- Power electronics
- Sensorics
- High-frequency electronics
Design for Excellence
- Design for manufacturability
- Design for reliability
- Design for programming and testability
- Design for sustainability
- Design for cost
Design Software and Tools
- Novelties in design software environment
- AI in design process
- Links between EDA, FEA, DFM, ECAD, MCAD tools
- Digital Twin, Design/Equipment/Production data handshake
Design Process and Product Life Cycle
- Hardware/software co-design
- Cross-industries data management
- Data security and the cloud
- End-of-life and discontinuation management
- CIRPASS – Digital Product Passport
- REACH (PFAS restriction proposal, SCIP database)
