PEDC in a nutshell
The 1st Pan-European Electronics Design Conference (PEDC) is a one of a kind Pan-European conference with technical and scientific peer-reviewed presentations. It will take place on 29-30 January in Vienna. The conference focuses on connecting the European EE Industry and Scientific Community and highlights the latest developments in electronics design from “silicon-to-systems”. Topics will include Development, Design for Excellence, Software and Tools, and the Design Process of electronic systems.
![csm_FED_20.09.23_403_2a104f0473](https://pedc.eu/wp-content/uploads/2024/04/csm_FED_20.09.23_403_2a104f0473.jpg)
Abstract Submission
PEDC organization team invites engineers, researchers, academics, students, technical experts, and industry leaders to submit abstracts for the Pan-European Electronics Design Conference.
We welcome abstracts summarizing original and previously unpublished work covering case histories, research, and discoveries.
Topics for Conference Presentations
Silicon-to-Systems
- Advanced Packaging
- PCB/PCBA
- Sub-system assembly
- Final system assembly
- Electro-mechanical co-design
- Power electronics
- Sensorics
- High-frequency electronics
Design for Excellence
- Design for manufacturability
- Design for reliability
- Design for programming and testability
- Design for sustainability
- Design for cost
Design Software and Tools
- Novelties in design software environment
- AI in design process
- Links between EDA, FEA, DFM, ECAD, MCAD tools
- Digital Twin, Design/Equipment/Production data handshake
Design Process and Product Life Cycle
- Hardware/software co-design
- Cross-industries data management
- Data security and the cloud
- End-of-life and discontinuation management
- CIRPASS – Digital Product Passport
- REACH (PFAS restriction proposal, SCIP database)