27-28

January 2027

Amsterdam – Netherlands

3rd Pan-European
Electronics Design
Conference

Two days of peer reviewed presentations and expert panels delivering immediate, actionable techniques for electronics design, verification and production.

Submit your abstract for the 3rd Pan-European Electronics Design Conference now

Joining forces

The Pan-European Electronics Design Conference is jointly hosted and organized by the Electronics Design and Manufacturing Association (FED) and the Global Electronics Association – two associations representing more than 3,700 companies from the electronics industry.

PEDC in a nutshell

The 3rd Pan-European Electronics Design Conference (PEDC) is a one of a kind Pan-European conference with technical and scientific peer-reviewed presentations. It will take place on January 27-28 in Amsterdam. The conference focuses on connecting the European EE Industry and Scientific Community and highlights the latest developments in electronics design from “Silicon to Systems”. Topics will include Development, Design for Excellence, Software and Tools, and the Design Process of electronic systems.

What you will be taking away

How to shorten design cycles without sacrificing reliability

Best practices for design for excellence in production

Tools & workflows to bridge software and hardware design

All technologies and processes for the development and production of electronic assemblies and systems

Unique exchange of experience with experts from industry and research

“Following the highly successful inaugural Pan-European Design Conference, join us for the second PEDC to connect with European electronics designers and experts, exchange insights and help shape the future of European electronics.

Dieter Müller

Chairman of the FED Board, Owner BMK Group

“With the 2^nd PEDC, we are continuing the success story of the new format of Pan-European Electronic Design Conference. As in the first edition, a Europe-wide panel of experts will compile the technical programme according to high quality standards and free from commercialisation.

Dr. Peter Tranitz

Global Electronics Association

“With AI today, if you’ve got to generate product carbon footprint for your electronic devices, for your sub-assemblies, from your cradle to gate or cradle to grave, instead of taking weeks, you can now take two minutes.”

Francis D’Souza

Banyan.eco

“Having a protection in the supply chain is very crucial to be sure that you know your supply chain and that you know who’s part of your supply chain.”

Guro Krosson

Confidee

“Transparency and collaboration are really going to be the key going forward in this industry to make it successful.”

Susan Kayesar

Siemens

“Automotive high-voltage design without simulation with component-level support is a wrong choice. Only by using accurate models you can assure your safety and precision in the early development phase of your product.”

Octavian Luca

Schaeffler AG Group