Program

Advanced.hdi – Bridging the Gap Between Chip and PCB – “Silicon to systems” – to enable Stack-Ups forHigh-Speed, High-Density Designs

• Michael Kress

UHDI PCBs vs. IC Substrates: Navigating the Overlap in Advanced Packaging

• Jan Pedersen

Additive Manufacturing for Advanced Microelectronic Packaging: Integration of Silicon Bare Dies viaInkjet Printing and NIL

• Pavel Kulha

Coffee Break

Enhancing Power Electronic Design Efficiency through Real-Time Thermal Feedback

• Wilfried Wessel

Approach for Coupled Simulations of Magnetic Power Loss and Temperature Distribution of a DC/DCConverter Used for Electric Vehicles

• Nicolae Badulescu

Hands-On Challenges and Solutions in Bidirectional GaN Switch Design

• Milan Marjanovic

Lunch break

Digital Twins for Efficient Power Circuit Design

• Dr. Mohammed Ali Khan

From Discrete to Integrated: Pitfalls and Best Practices in 3D FEM Modeling of Magnetic Components

• Juris Vencels

Finite element modelling and analysis of through-hole-technology assemblies for space applications

• Dr. Harald Ziegelwanger

Coffee Break

PCB Embedding Technology: A pathway to enhanced product integration

• Janagan Papperi
• Devarajulu Deenadayalan

Simulation-Driven Insights into Copper Plating and Via Filling

• Robrecht Belis

Universal Simulation Environment for Comprehensive Electronic System Resilience

• Tomáš Kašpar

FPGA-Driven AI for Real-Time Fault Detection and HIL Validation

• Cristina Villegas Soriano

Deep Learning for Automated Netlist Generation from Impedance Spectra

• Richard Blakey

Demystifying the use of AI, ML and LLMs for High-Speed PCB-Design and Signal-/Power-Integrity Issues

• Ralf Bruening

Coffee Break

How the new challenges of electronics will impact DfM?

• Nicolas Feyfant

Design for Expected Costs – Continuous Cost-Assessment for Better Products

• Sebastian Schaal

Cost-Effective Design: Reducing Manufacturing Expenses Before Production Begins

• Paul Carpine

Lunch Break

3D Soldermask: New Features & Capabilities to improve PCB Quality by Additive Design

• Celia Wenzler

Design for Manufacturing – in Selective Reflow Processes (Rework)

• Joerg Nolte

Forgotten, misjudged, indispensable? Backdrilling in a high-speed check!

• Radek Reichel

Coffee Break

Automated 3D Analysis of Clearance and Creepage Paths in PCB Design

• Dr. Michael Martinek

Design Rules for Depaneling and the matching Workpiece Carriers

• Patrick Stockbrügger

t.b.d

• t.b.d

Closing Ceremony PEDC 2026

From Principles to Practice: Cisco’s Journey to Embed Circularity into Product Design

• Mrs. Wendy Ng

DPP4E: Increasing Circularity and Transparency in the Electronics Product Life Cycle through DigitalProduct Passports

• Wilfried Lepuschitz

tbd

Coffee Break

Towards Sustainable PCB Design: Process Efficiency and Material Innovation for a Greener Lifecycle

• Jürgen Wolf

SMT, COB, FC and PE in combination and requirementsfor the application of solder paste for the different technologies

• Jörg Trodler

SustainaCircuits – etching free inkjet based printed circuit board

• Keisuke Ito

Lunch Break

Using Agentic AI to drive down EMS and OEM compliance and design costs

• Francis D’Souza, Zakaria Bouachra

Leveraging AI for Streamlined PCB Fabrication and BOM Pricing Automation

• Dhanish M S

tbd

Coffee Break

Enhancing Simulative Product Development with Machine Learning (ML) and Artificial Intelligence (AI)

• Rene Fuger

New possibilities in 3D electronics development

• Carsten Kindler

tbd