PEDC organization team invites engineers, researchers, academics, students, technical experts, and industry leaders to submit abstracts for the 2nd Pan-European Electronics Design Conference. PEDC organization team welcomes abstracts summarizing original and previously unpublished work covering
case histories, research, and discoveries.
Motivation of Next Generation Designers, New Design Standards/standardization.
Topics for Conference Presentations
Silicon to Systems
- Package-to-PCB co-design and PCBA co-optimization, e.g. uHDI, substrates
- Electro-mechanical co-design and system co-optimization, e.g. component assembly
- Multi-physics simulations: signal and power integrity, thermal, mechanical, optical
- Power Electronics design, e.g. high voltage, power delivery, cooling solutions
- Sense and Control Electronics design, e.g. MEMS, NEMS
- High speed digital design, e.g. connectivity, high bandwidth interfaces
- RF/microwave/mm-wave design, e.g. EMI/EMC, multi-sensor inter-operability
Design for Excellence
- Design for Manufacturability
- Design for Reliability
- Design for Testability
- Design for Circularity
- Design for Cost
Design Software and Tools
- Novelties in EDA software: AI and simulation implementations
- AI in Design process
- Digital Twin, Model Based Definition
- Design/Equipment/Production data handshake
Sustainable designs and Product Life Cycle
- Power consumption
- Eco-friendly materials
- Cross-industries data management
- Data security and the cloud
- End-of-Life and obsolescence management
- Understanding and applying Directives
Comprehensive list but does not claim to be definitive; other appropriate topics will also be given
consideration
Please only use this online form to submit your abstract. Abstracts must be written in English. The submission deadline is July 31, 2025. Please inform yourself about our speaker conditions and our non-commercialism policy which you must agree to at the end of the form.
Abstract Submission
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