Program

Pan-European
Electronics Design Conference

29-30 January 2025, Vienna

Day 1 - 29.01.2025

11:00
Registration
11:30
Networking Lunch
13:00
Opening

Welcome note

  • Matt Kelly (CTO of IPC)
  • Dieter Müller (Chairman of FED)
13:30
Keynote 1

Game changing future electronics using new passive components by combining new materials with AI

  • Prof. Dr. Thomas Ebel (University of Southern Denmark)
14:15
Intro Panel 1

The Role of AI in Electronics

  • Alexander Gerfer (Würth Elektronik eiSos, Germany)
14:30
Panel Discussion

The Role of AI in Electronics

Moderation:

  • Alexander Gerfer (Würth Elektronik eiSos, Germany)

Panellists:

  • Prof. Dr. Thomas Ebel (University of Southern Denmark)
  • Francis D’Souza (Banyan.eco, France)
  • Jayasimha BR (Sienna ECAD Technologies, India)
  • Dr. Reinhardt Seidel (DEEPTRONICS, Germany)
15:15
Coffee break
15:45
Keynote 2

A Silicon-to-Systems approach of an open-source smartwatch design

  • Lukas Henkel (OV Technologies, Germany)
16:30
Intro Panel 2

The Green Line throughout the Electronics Product Life Cycle

  • Didrik Bech (Altium, Norway)
16:45
Panel Discussion

The Green Line throughout the Electronics Product Life Cycle

Moderation:

  • Didrik Bech ( Altium, Norway)

Panellists:

  • Dr. Wolfgang Heinbach (Syliom and COGD, Germany)
  • Sebastian Schaal (Luminovo, Germany)
  • Guro Krossen (Confidee, Norway)
  • Susan Kayesar (Siemens, Israel)
  • Diana Radovan (IPC, Europe)
17:30
Closing Day 1
18:00
Networking Reception

Day 2 - 30.01.2025 - Room 1

Track 1: Silicon-to-Systems and Design Techniques
08:30
Advanced Packaging

Inductive Components on Silicon Substrate 300mm Wafer

  • Jens Kehl (Würth Elektronik eiSos, Germany)

Integration of Advanced Wireless Technologies in Compact Consumer Device with Accurate Positioning Capabilities

  • Dr. Malek Chaabane (habemus electronic + transfer, Germany)

Techniques of Interconnection in Electronics: An Engineering Design Roadmap to Advanced Integration and Knowledge Integration

  • Cosmin Moisa (Continental, Romania)
10:00
Coffee break
10:30
High Frequency

Design for manufacturing and reliability of a high-speed HDI technology for space applications

  • Dr. Maarten Cauwe (IMEC, Belgium)

A study on mitigation of resonances in metal shielding enclosures for integrated circuits 

  • Maria Cuesta-Martín (Würth Elektronik eiSos, Spain)

Overcoming PCB Design/Simulation challenges while using Very Highspeed Ethernet Switch chipsets

  • Suresh Nidasesi, Savita R. Ganjigatti (Sienna ECAD Technologies, India)

 

12:00
Lunch
13:30
High Power

High Voltage simulation with electro-thermal models 

  • Octavian Luca (Vitesco, Romania)

Novel Method to Prove Power Module Design Robustness Using Hyperparameter Tuning With SHERPA

  • Wilfried Wessel (TU Dublin and Siemens EDA Germany)

Software based design optimization of an embedded power module

  • Janagan Papperi Devarajulu Deenadayalan (AT&S, Austria)

 

15:00
Coffee break
15:30
Final System Assembly

Press-fit technology – experiences with the design of press-fit zones 

  • Frank Uibel (Uibel Consulting, Germany)

Establishing Design Rules for (Laser) Depaneling of Printed Circuit Boards

  • Patrick Stockbrügger (LPKF, Germany)

Multiphysics System Simulation of Power Electronics and their Usage for Digital Twins

  • Rene Fuger (CADFEM, Austria)
17:00
Closing remarks
17:30
End of conference

Day 2 - 30.01.2025 - Room 2

Track 2: Design for Excellence, Software and Tools
08:30
DFM, DFX, DFC

AI-assisted DfM in THT-solder joints

  • Dr. Reinhardt Seidel (DEEPTRONICS, Germany)

Augmented BoM Scanning : the Ultimate in Design for Excellence

  • Arnaud Grivon (Thales, France)

Design for Cost – key aspects of PCB production costs                

  • Jennifer Vincenz (ILFA, Germany)

 

10:00
Coffee break
10:30
DFF, DFP, DFT

The role of the digital twin concept in assessing and optimizing copper electroplating process performance

  • Robrecht Belis (Elsyca, Belgium)

PCB design for programmability (DFP): Influence of the PCB design and the programming system on the Assembly Production

  • Pietro Poletto (SMH, Italy)

Robot-Assisted Testing Concept for Electronic Assemblies in Small Batch Sizes Using AI

  • Dr. Richard Scheicher (BMK professional electronics, Germany)

 

12:00
Lunch
13:30
Digital Twin and Simulations

Engineering and Adapting Model-based PCB Design in Step with Sustainability and Digital Twins

  • Filbert Arzola (Raytheon, USA)

Enhanced Modeling and Characterization of Copper Foils for PCB Design

  • Dr. Lukasz Nowicki (QWED, Poland)

OpenMagnetics, a free open-source platform for design magnetic components with academia knowledge

  • Alfonso Martínez (OpenMagnetics, Spain)
15:00
Coffee break
15:30
AI

AI-Driven Optimization of Semiconductor Selection for Enhanced Reliability in Power Electronics Converters

  • Dr. Mohammed Ali Khan (University of Southern Denmark)

AI-Driven Automation of ECAD Library

  • Jayasimha BR (Sienna ECAD Technologies, India)

Using AI for sustainable electronics design

  • Francis D’Souza (Banyan.eco, France)

Status: Nov. 28, 2024 / changes are possible

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