Day 1 - 29.01.2025
Game changing future electronics using new passive components by combining new materials with AI
- Prof. Dr. Thomas Ebel
The Role of AI in Electronics
- Alexander Gerfer
The Role of AI in Electronics
- Alexander Gerfer (Moderation)
- Prof. Dr. Thomas Ebel
- Mr. Francis D’Souza
- Dr. Richard Scheicher
- Mr. Jayasimha BR
- Dr. Reinhardt Seidel
A Silicon-to-Systems approach of an open-source smartwatch design
- Lukas Henkel
Regulations and Sustainability along the Electronics Product Life Cycle
- Didrik Bech
Regulations and Sustainability along the Electronics Product Life Cycle
- Didrik Bech (Moderation)
- Dr. Wolfgang Heinbach
- Ms. Inga Schwarz
- Ms. Guro Krossen
- Ms. Susan Kayesar
t.b.d.
Day 2 - 30.01.2025 - Room 1
Inductive Components on Silicon Substrate 300mm Wafer
- Mr. Jens Kehl
Integration of Advanced Wireless Technologies in Compact Consumer Device with Accurate Positioning Capabilities
- Dr. Malek Chaabane
Techniques of Interconnection in Electronics: An Engineering Design Roadmap to Advanced Integration and Knowledge Integration
- Mr. Cosmin Moisa
Solve EMC / EMI situations in automotive application A study on mitigation of resonances in metal shielding enclosures for integrated circuits Overcoming PCB Design/Simulation challenges while using Very Highspeed Ethernet Switch chipsets
- Mr. Lorandt Foelkel
- Ms. Maria Cuesta-Martín
- Mr. Suresh Nidasesi
High Voltage simulation with electro-thermal models Novel Method to Prove Power Module Design Robustness Using Hyperparameter Tuning With SHERPA Software based design optimization of an embedded power module
- Mr. Octavian Luca
- Mr. Wilfried Wessel
- Mr. Janagan Papperi Devarajulu Deenadayalan
Press-fit technology – experiences with the design of press-fit zones Establishing Design Rules for (Laser) Depaneling of Printed Circuit Boards AI-assisted DfM in THT-solder joints
- Mr. Frank Uibel
- Mr. Patrick Stockbrügger
- Dr. Reinhardt Seidel
Day 2 - 30.01.2025 - Room 2
Design for manufacturing and reliability of a high-speed HDI technology for space applications
- Dr. Maarten Cauwe
Augmented BoM Scanning : the Ultimate in Design for Excellence
- Mr. Arnaud GRIVON
Design for Cost – key aspects of PCB production costs
- Mrs. Jennifer Vincenz
The role of the digital twin concept in assessing and optimizing copper electroplating process performance
- Dr. Agnieszka Franczak
PCB design for programmability (DFP): Influence of the PCB design and the programming system on the Assembly Production
- Mr. Pietro Poletto
Robot-Assisted Testing Concept for Electronic Assemblies in Small Batch Sizes Using AI
- Dr. Richard Scheicher
A Specialized Overlay for Advanced Full-Wave Electromagnetic Simulations within AutoCAD Environment
- Dr. Malgorzata Celuch
OpenMagnetics, a free open-source platform for design magnetic components with academia knowledge
- Mr. Alfonso Martínez
Multiphysics System Simulation of Power Electronics and their Usage for Digital Twins
- Mr. Rene Fuger
AI-Driven Optimization of Semiconductor Selection for Enhanced Reliability in Power Electronics Converters
- Dr. Mohammed Ali Khan
AI-Driven Automation of ECAD Library
- Mr. Jayasimha BR
Using AI for sustainable electronics design
- Mr. Francis D’Souza