Topics for Conference Presentations
Silicon-to-Systems
- Advanced Packaging
- PCB/PCBA
- Sub-system assembly
- Final system assembly
- Electro-mechanical co-design
- Power electronics
- Sensorics
- High-frequency electronics
Design for Excellence
- Design for manufacturability
- Design for reliability
- Design for programming and testability
- Design for sustainability
- Design for cost
Design Software and Tools
- Novelties in design software environment
- AI in design process
- Links between EDA, FEA, DFM, ECAD, MCAD tools
- Digital Twin, Design/Equipment/Production data handshake
Design Process and Product Life Cycle
- Hardware/software co-design
- Cross-industries data management
- Data security and the cloud
- End-of-life and discontinuation management
- CIRPASS – Digital Product Passport
- REACH (PFAS restriction proposal, SCIP database)
Comprehensive list but does not claim to be definitive; other appropriate topics will also be given consideration
Abstract Submission
PEDC organization team invites engineers, researchers, academics, students, technical experts, and industry leaders to submit abstracts for the Pan-European Electronics Design Conference. We welcome abstracts summarizing original and previously unpublished work covering case histories, research, and discoveries.
