Confirmed Presentations
Here you will find presentations that have already been approved by the Technical Program Committee. We reserve the right to assign the presentations to other slots. We will publish the complete program as soon as possible.
Keynotes
- AI in Electronics Product Development: Separating Hype from Reality
Tomide Adesanmi, Circuit Mind
Silicon to Systems
- Universal Simulation Environment for Comprehensive Electronic System Resilience
Tomáš Kašpar, SVS FEM - Advanced.hdi – Bridging the Gap Between Chip and PCB – “Silicon to systems” – to enable Stack-Ups forHigh-Speed, High-Density Designs
Michael Kress, Würth Elektronik - Additive Manufacturing for Advanced Microelectronic Packaging: Integration of Silicon Bare Dies via Inkjet Printing and NIL
Pavel Kulha, PROFACTOR
Design for Excellence
- How the new challenges of electronics will impact DfM?
Nicolas Feyfant, Agon - Hands-On Challenges and Solutions in Bidirectional GaN Switch Design Milan Marjanovic, Electronic Design
- Design for Manufacturing – in Selective Reflow Processes (Rework)
Joerg Nolte, Ersa - Design for Expected Costs – Continuous Cost-Assessment for Better Products
Sebastian Schaal, Luminovo - Design Rules for Depaneling and the matching Workpiece Carriers
Patrick Stockbrügger, LPKF
Design Software and Tools
- Enhancing Simulative Product Development with Machine Learning (ML) and Artificial Intelligence (AI)
Rene Fuger, CADFEM - Digital Twins for Efficient Power Circuit Design
Dr. Mohammed Ali Khan, University of South Denmark - Automated 3D Analysis of Clearance and Creepage Paths in PCB Design
Dr. Michael Martinek, e-laborate - FPGA-Driven AI for Real-Time Fault Detection and HIL Validation
Cristina Villegas Soriano, Silicon Austria - Enhancing Power Electronic Design Efficiency through Real-Time Thermal Feedback
Wilfried Wessel, Siemens - Finite element modelling and analysis of through-hole-technology assemblies for space applications
Dr. Harald Ziegelwanger, Elastic Simulations
Sustainable Designs and Product Life Cycle
- DPP4E: Increasing Circularity and Transparency in the Electronics Product Life Cycle through DigitalProduct Passports
Wilfried Lepuschitz, Beeproduced - SMT, COB, FC and PE in combination and requirements
Jörg Trodler, Trodler EAVT - Towards Sustainable PCB Design: Process Efficiency and Material Innovation for a Greener Lifecycle
Jürgen Wolf, Würth Elektronik
