Program

Advanced.hdi – Bridging the Gap Between Chip and PCB – “Silicon to Systems” – to enable Stack-Ups for High-Speed, High-Density Designs

• Michael Kress (Würth Elektronik eiSos, Germany)

UHDI PCBs vs. IC Substrates: Navigating the Overlap in Advanced Packaging

• Jan Pedersen (NCAB Group AB, Sweden)

Additive Manufacturing for Advanced Microelectronic Packaging: Integration of Silicon Bare Dies via Inkjet Printing and NIL

• Pavel Kulha (Profactor, Austria)

Coffee Break

Enhancing Power Electronic Design Efficiency through Real-Time Thermal Feedback

• Wilfried Wessel (Siemens EDA Ireland Ltd.)

Approach for Coupled Simulations of Magnetic Power Loss and Temperature Distribution of a DC/DCConverter Used for Electric Vehicles

• Nicolae Badulescu (Schaeffler Romania SRL)

Hands-On Challenges and Solutions in Bidirectional GaN Switch Design

• Milan Marjanovic (Electronic Design, Germany)

Lunch break

Digital Twins for Efficient Power Circuit Design

• Dr. Mohammed Ali Khan (University of Southern Denmark)

From Discrete to Integrated: Pitfalls and Best Practices in 3D FEM Modeling of Magnetic Components

• Juris Vencels (TRAFOLO Engineering, Latvia)

Finite element modelling and analysis of through-hole-technology assemblies for space applications

• Dr. Harald Ziegelwanger (Elastic-Simulations GmbH, Austria)

Coffee Break

PCB Embedding Technology: A pathway to enhanced product integration

• Janagan Papperi Devarajulu Deenadayalan (AT&S Austria Technologie & Systemtechnik AG, Austria)

Simulation-Driven Insights into Copper Plating and Via Filling

• Robrecht Belis (Elsyca, Belgium)

Universal Simulation Environment for Comprehensive Electronic System Resilience

• Tomáš Kašpar (SVS FEM s.r.o., Czech Republic)

FPGA-Driven AI for Real-Time Fault Detection and HIL Validation

• Cristina Villegas Soriano (Silicon Austria Labs GmbH)

Deep Learning for Automated Netlist Generation from Impedance Spectra

• Richard Blakey (Würth Elektronik eiSos GmbH & Co. KG, Germany)

Demystifying the use of AI, ML and LLMs for High-Speed PCB-Design and Signal-/Power-Integrity Issues

• Ralf Bruening (Zuken GmbH, Germany)

Coffee Break

Cost-Effective Design: Reducing Manufacturing Expenses Before Production Begins

• Paul Carpine (Siemens, Germany)

Design for Expected Costs – Continuous Cost-Assessment for Better Products

• Sebastian Schaal (Luminovo GmbH, Germany)

Design for Compliance – why the Defence Industry might be Europe’s best sustainability driver

• Guro Krossen (CONFIDEE, Norway)

Lunch Break

How the new challenges of electronics will impact DfM?

• Nicolas Feyfant

Design for Manufacturing – in Selective Reflow Processes (Rework)

• Joerg Nolte (Ersa GmbH, Germany)

Forgotten, misjudged, indispensable? Backdrilling in a high-speed check!

• Radek Raichel (Var Industries, Germany)

Coffee Break

Automated 3D Analysis of Clearance and Creepage Paths in PCB Design

• Dr. Michael Martinek (e-laborate Innovations GmbH, Germany)

3D Soldermask: New Features & Capabilities to improve PCB Quality by Additive Design

• Celia Wenzler (Notion Systems GmbH, Germany)

Design Rules for Depaneling and the matching Workpiece Carriers

• Patrick Stockbrügger (LPKF Laser & Electronics AG, Germany), Oliver Hagemes (Rösnick GmbH, Germany)

Closing Ceremony PEDC 2026

From Principles to Practice: Advancing Circularity in Electronic Product Design

• Wendy Ng (Cisco Systems, United States)

DPP4E: Increasing Circularity and Transparency in the Electronics Product Life Cycle through DigitalProduct Passports

• Wilfried Lepuschitz (bee produced GmbH, Austria)

tbd

Coffee Break

Towards Sustainable PCB Design: Process Efficiency and Material Innovation for a Greener Lifecycle

• Jürgen Wolf (Würth Elektronik GmbH & Co. KG, Germany)

SMT, COB, FC and PE in combination and requirementsfor the application of solder paste for the different technologies

• Jörg Trodler (Trodler EAVT, Germany)

SustainaCircuits – etching free inkjet based printed circuit board

• Keisuke Ito (Elephantech Inc., Japan)

Lunch Break

Using Agentic AI to drive down EMS and OEM compliance and design costs

• Francis D’Souza, Zakaria Bouachra (Banyan.eco, France)

Leveraging AI for Streamlined PCB Fabrication and BOM Pricing Automation

• Abdul Dhanish (Sienna ECAD Technologies, India)

tbd

Coffee Break

Enhancing Simulative Product Development with Machine Learning (ML) and Artificial Intelligence (AI)

• Rene Fuger (CADFEM (Austria) GmbH, Austria)

tbd