Program

UHDI PCBs vs. IC Substrates: Navigating the Overlap in Advanced Packaging
Jan Pedersen (NCAB Group AB, Sweden)

Bridging the Gap Between Chip and PCB – “Silicon to Systems” – to enable Stack-Ups for High-Speed, High-Density Designs
Michael Kress (Würth Elektronik eiSos, Germany)
Helene Ströbel (Würth Elektronik eiSos, Germany)

Additive Manufacturing for Advanced Microelectronic Packaging: Integration of Silicon Bare Dies via Inkjet Printing and NIL
Pavel Kulha (Profactor, Austria)

Enhancing Power Electronic Design Efficiency through Real-Time Thermal Feedback
Wilfried Wessel (Siemens EDA Ireland Ltd.)

Approach for Coupled Simulations of Magnetic Power Loss and Temperature Distribution of a DC/DC Converter Used for Electric Vehicles
Nicolae Badulescu (Schaeffler Romania SRL)

Hands-On Challenges and Solutions in Bidirectional GaN Switch Design
Milan Marjanovic (Electronic Design, Germany)

Digital Twins for Efficient Power Circuit Design
Dr. Mohammed Ali Khan (University of Southern Denmark)

From Discrete to Integrated: Pitfalls and Best Practices in 3D FEM Modeling of Magnetic Components
Juris Vencels (TRAFOLO Engineering, Latvia)

Finite element modelling and analysis of through-hole-technology assemblies for space applications
Dr. Harald Ziegelwanger (Elastic-Simulations GmbH, Austria)

PCB Embedding Technology: A pathway to enhanced product integration
Janagan Papperi Devarajulu Deenadayalan (AT&S Austria Technologie & Systemtechnik AG, Austria)

Simulation-Driven Insights into Copper Plating and Via Filling
Robrecht Belis (Elsyca, Belgium)

Universal Simulation Environment for Comprehensive Electronic System Resilience
Tomáš Kašpar (SVS FEM s.r.o., Czech Republic)

Closing Remarks
Moderator

FPGA-Driven AI for Real-Time Fault Detection and HIL Validation
Cristina Villegas Soriano (Silicon Austria Labs GmbH)

Deep Learning for Automated Netlist Generation from Impedance Spectra
Richard Blakey (Würth Elektronik eiSos GmbH & Co. KG, Germany)

Demystifying the use of AI, ML and LLMs for High-Speed PCB-Design and Signal-/Power-Integrity Issues
Ralf Bruening (Zuken GmbH, Germany)

Cost-Effective Design: Reducing Manufacturing Expenses Before Production Begins
Paul Carpine (Siemens, Germany)

Design for Expected Costs – Continuous Cost-Assessment for Better Products
Sebastian Schaal (Luminovo GmbH, Germany)

Design for Compliance – why the Defence Industry might be Europe’s best sustainability driver
Guro Krossen (CONFIDEE, Norway)

How the new challenges of electronics will impact DfM?
Nicolas Feyfant (Agon, France), Christophe Lotz (Aster Technology, France) 

Design for Manufacturing – in Selective Reflow Processes (Rework)
Joerg Nolte (Ersa GmbH, Germany)

Forgotten, misjudged, indispensable? Backdrilling in a high-speed check!
Radek Raichel (Var Industries, Germany)

Automated 3D Analysis of Clearance and Creepage Paths in PCB Design
Dr. Michael Martinek (e-laborate Innovations GmbH, Germany)

3D Soldermask: New Features & Capabilities to improve PCB Quality by Additive Design
Kai Keller (Notion Systems GmbH, Germany)

Design Rules for Depaneling and the matching Workpiece Carriers
Patrick Stockbrügger (LPKF Laser & Electronics AG, Germany)
Oliver Hagemes (Rösnick GmbH, Germany)

Closing Remarks
Moderator

From Principles to Practice: Advancing Circularity in Electronic Product Design
Colin Seward (Cisco Systems, United Kingdom)

DPP4E: Increasing Circularity and Transparency in the Electronics Product Life Cycle through Digital Product Passports
Wilfried Lepuschitz (bee produced GmbH, Austria)

tbd

Towards Sustainable PCB Design: Process Efficiency and Material Innovation for a Greener Lifecycle
Jürgen Wolf (Würth Elektronik GmbH & Co. KG, Germany)

SMT, COB, FC and PE in combination and requirements for the application of solder paste for the different technologies
Jörg Trodler (Trodler EAVT, Germany)

SustainaCircuits – etching free inkjet based printed circuit board
Michiharu Hayashi (Elephantech Inc., Japan)

Using Agentic AI to drive down EMS and OEM compliance and design costs
Francis D’Souza, Zakaria Bouachra (Banyan.eco, France)

Leveraging AI for Streamlined PCB Fabrication and BOM Pricing Automation
Abdul Dhanish (Sienna ECAD Technologies, India)

Agentic AI for Material Intelligence in Sustainable Product Development
Niraj Deo (Viridium AI, US)

Enhancing Simulative Product Development with Machine Learning (ML) and Artificial Intelligence (AI)
Rene Fuger (CADFEM (Austria) GmbH, Austria)

Intelligent Decision Support in a Seamless Integrated Process Chain
Carsten Kindler (Altium, Germany)