Day 1 - Session
Registration
Welcome Notes
- FED
- GEA
Keynote 1
A vision for a semiconductor quantum processor
- Lieven Vandersypen (TU Delft, The Netherlands)
Panel 1
How is the EDA industry implementing/approaching the design of the quantum world?
Lunch
Keynote 2
AI data centers: termal management from silicon to system
- Jean-Jacques Chanut (2CRSi, France)
Panel 2
Data centers cooling, power
Coffee Break
Invited Talks
Analysing DfX Principles and Circularity Trade-offs in Mobile Phone Design
- Priya Saikumar (University of Oxford, UK)
Innovation starts with standardisation: A new perspective on mechanical PCB design
- Dirk Stans (Eurocircuits, Belgium)
From 48 V to 1,200 V — A Cross-Domain Analysis of DC Grid Architectures for Industry, AI Data Centers, and Intelligent Lighting — Voltage Rails, Conversion Topologies, and the Path to 95 % Grid-to-Load Efficiency
- Ralf Regenhold (Würth Elektronik, Germany)
Wrap-up Day 1
Reception (food and drinks)
Silicon-to-Systems Designs & Design Software and Tools
Session 1: Silicon-to-Systems
Rethinking the PCB in COWOP: A Vertical Interconnect Approach
- Joan Tourné (Nextgin Technology BV, Netherlands)
Understanding power delivery through bandwidth
- André Dekker (VDL Sintecs, Netherlands)
Silicon to Systems: Scaling Electronics Through Early PCB Co-Engineering
- Helene Ströbel (Würth Elektronik, Germany)
Coffee Break
Session 2: Power Conversion
Simplifying Single-Stage AC/DC Power Conversion: Technologies and Practical Design Challenges
- Milan Marjanovic (Micronik Solutions GmbH, Germany)
Optimized Integrated Magnetics in a 400V/500W GaN-Based LLC DC-DC Converter for Improved Efficiency and Thermal Performance
- Asaad Alduais (Würth Elektronik eiSos Group, Germany)
Extending an LT8316 FLYBACK to 800V via BJT CASCODE: LTSPICE Design Study of a 36 W Auxiliary Supply for a Universal-Input EV Charger
- Willy Stephen Tounsi Fokui (Teleconnect GmbH, Germany)
Lunch Break
Session 3: AI in Soft- and Hardware
Verification-First: Why Correctness, Not Generation, Is the Real Bottleneck for AI in High-Speed PCB Design
- Ruediger Klein (Teleconnect GmbH, Germany)
Embedding Regulatory Physics in Generative PCB Design: A Constraint-Based Approach to First-Pass EMC Compliance
- Wael Elrifai (Vectis.ai, Belgium)
System-Level Real-Time Validation of FPGA-Embedded AI for Power Electronics Applications
- Cristina Villegas (Soriano Silicon Austria Labs, Austria)
Session 4: Enablement and Simulations
Who Picked This MOSFET? Open-Source Data Standards and Component Selection for Power Converters
- Alfonso Martínez de la Torre (Würth Elektronik , Spain)
Quality of Simulations in Automotive Electronics Reliability
- Marius Tarnovetchi (Schaeffler, Romania)
Enabling Advanced PDNs for AI and HPC through PCB-Level Integration and Architecture
- Athanasios Kallinis (Schweizer Electronic, China)
Closing Ceremony PEDC 2027
Sustainable Designs, Product Life Cycle & Development Process
Session 1: Circularity
A Framework for Circular Economy Driven Sustainable Cable Harness Design and Material Management for Harsh Environment Applications
- Didem Üstün (FNSS Defense Systems, Turkey)
Manufacturing Pathways for Circular Bio-Based Printed Circuit Boards: A Systematic Mapping of the Literature
- Sebastian Calvo (University of Oxford, UK)
Building a Circular Electronics Economy: A Legal and Policy Framework for Extending Electronic Product Lifespans
- Ibrahim Badawi (Seattle Law School , US)
Coffee Break
Session 2: Sustainability and Product Life Cycle
Product Carbon Footprint of Printed Circuit Boards – Methodology, Challenges and First Insights
- Jürgen Wolf (Würth Elektronik GmbH & Co. KG, Germany)
Designing Beyond Release: Good Documentation Practices and Obsolescence Strategies for Long-Lifecycle Electronics
- Marco Haeuser MHD – Marco Häuser Design, Germany)
The CRA Applies Only to Software – a Costly Misconception
- Matthias Markut (HANZA BMK professional electronics GmbH, Germany)
Lunch Break
Session 3: Design and Development Process
Challenges in PCB design for RF applications in CubeSat environments
- Sergio Monjo Puchol (Alén Space, Spain)
It’s the CAD Library, stupid!
- Richard Prent (Novatrace, Netherlands)
Solid-State Transformers and the Medium-Frequency Transformer Bottleneck: Magnetics Challenges on the Path to Scale
- Claudio Cañete (Wurth Elektronik, Germany)
Session 4: Design for Excellence
Risk-Calibrated DFM: How to Tune PCB Manufacturing Rules to Catch Expensive Problems Without Creating Noise
- Susan Kayesar (Siemens, Israel)
Closing the Gap Between Simulation and Test: Solder Joint Lifetime and Board-Level Warpage Correlation
- Iulian-Ionut Ailinei (AUMOVIO TECHNOLOGIES ROMANIA S.R.L., Romania)
How accurate power measurements supports the design and development of low-carbon technology equipment
- Michael King (Cisco, US)